Philips TDA8002C Manual do Utilizador descarregar pdf (Página 16)

1999 Oct 12 16

Philips Semiconductors Product speciﬁcation

IC card interface TDA8002C

LIMITING VALUES

In accordance with the Absolute Maximum Rating System (IEC 134); note 1.

Note

1. Stress beyond these levels may cause permanent damage to the device. This is a stress rating only and functional

operation of the device under this condition is not implied.

HANDLING

Every pin withstands the ESD test according to MIL-STD-883C class 3 for card contacts, class 2 for the remaining.

Method 3015 (HBM 1500 Ω, 100 pF) 3 positive pulses and 3 negative pulses on each pin with respect to ground.

THERMAL CHARACTERISTICS

SYMBOL PARAMETER CONDITIONS MIN. MAX. UNIT

DDD

digital supply voltage −0.3 +6.5 V

DDA

analog supply voltage −0.3 +6.5 V

card supply voltage pins;

XTAL1, XTAL2, ALARM, CS, MODE,

RSTIN, CLKSEL, AUX2UC, AUX1UC,

CLKDIV1, CLKDIV2, CLKOUT,

STROBE, CMDVCC, CV/TV and OFF

−0.3 +6.5 V

i(card)

input voltage on card contact pins;

I/O, AUX2, PRES, PRES, AUX1, CLK,

RST and V

−0.3 +6.5 V

electrostatic handling voltage

on pins I/O, AUX2,

PRES, PRES,

AUX1, CLK, RST and V

−6+6kV

on all other pins −2+2kV

stg

storage temperature −55 +125 °C

tot

continuous total power dissipation

TDA8002CT/x T

amb

= −25 to +85 °C − 0.56 W

TDA8002CG T

amb

= −25 to +85 °C − 0.46 W

amb

ambient temperature −25 +85 °C

junction temperature − 150 °C

SYMBOL PARAMETER CONDITIONS VALUE UNIT

th(j-a)

thermal resistance from junction to ambient in free air

SOT136-1 70 K/W

SOT401-1 91 K/W

1 2 ... 11 12 13 14 15 16 17 18 19 20 21 ... 27 28

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